Precision BGA Stencil
1. Pioneering half etching process, let some components fit into the groove
Protect components to avoid burns.
2. Cooling hole patented design, rapid heat dissipation to avoid damage to components due to excessive temperature.
3. Ultra-precise round square hole positioning, precision of hole, round square hole design. Easy to take off the steel. Make the operation more smooth.
4. Double blister packaging, hard paper package, protect the steel mesh from being crushed and deformed during transportation.

Compatible models: MATE 7/G7/G8X/MATE 8/P8/P9/P10/MATE9/MATE 9 PRO/NOVA 2S/P20/P20 PRO/MATE 10/P30/P30 PRO/MATE 20/MATE 20 PRO/9X/9X PRO/20S/NOVA 5/5Z/P40/P40 PRO/MATE 307MATE 30 PRO